电子元器件焊接工艺概述

Flow soldering(flow)波峰焊

Reflow soldering (reflow)回流焊

回流焊中常见的问题

Wicking up phenomenon灯芯现象

Phenomenon in which solder is sucked up to IC leads due to temperature variation on a board composed of parts with different heat capacities during heating in a reflow furnace.

Manhattan-phenomenon立碑现象

Phenomenon that the chip stands up when the amount of solder on the component terminals is different or surface tension difference occur due to temperature variations.

回流炉内传热分析

主要物理模型及边界条件

分析设置

分析结果

电烤箱应用案例

优化方案

• 优化目标：提升风速和温度分布均匀性

• 改进措施 ：减少气体回流，优化隔板间隙

灯芯效应分析应用案例

灯芯效应分析结果

混合搅拌

Fluent中的多相流模型

颗粒流动的分类

颗粒流动模拟方案

分析方法

颗粒流动模型(DPM)

颗粒溶解

粉料混合