5G终端产品设计及挑战

Why 5G?

- Higher bandwidths (available at higher frequencies)

- Many of these frequency ranges are largely untapped in terms of current wireless traffic (avoid overcrowding and interference issues )

Major Challenges:

- Smaller physical size scales, shorter wavelengths, higher design sensitivities

- Temperature impact becomes significant

- Larger electromagnetic losses

- Difficult-to-characterize frequency dependence of material properties

- More pronounced wave effects of the EM fields at smaller wavelengths

Ansys电-热-力解决方案介绍

Ansys Multiphysics Technologies for Electronic Systems Reliability

Electro-Thermal Solutions

-Thermal analysis is tightly integrated with ANSYS’s Electromagnetic (EM) solvers

Thermal aware Reliability Analysis on Chip

Ansys Workbench Scheme for Warpage Analysis Process（Thermal-Stress）

Ansys电-热-力仿真案例

手机中PCB热力可靠性分析

Stress and Strain Analysis of Solderball

总结

-终端产品复杂度越来越高，需要考虑多物理场耦合的分析方案；

-Ansys电热力耦合方案可以有效解决终端产品的电磁热力可靠性问题；如终端产品散热、热应力及结构失效等结构可靠性问题。