封装结构的热力可靠性方案

Influence of flip-chip attachment process on IC

Moisture DiffusionMoisture Stress

Thermal CyclingThermal Stresses

Solder Joint Reliability

Shock Analysis

Drop Test

Crack Initiation and Crack Growth

Multi-physics Reliability

Warpage Analysis

Model import

Thermal

Stress

Stress and Strain Analysis of Solderball

Additional Solution for the fatigue performance of solderball

3DIC热力设计解决方案